- All sections
- C - Chemistry; metallurgy
- C09J - Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives
- C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
Patent holdings for IPC class C09J 7/20
Total number of patents in this class: 1008
10-year publication summary
|
20
|
40
|
55
|
220
|
231
|
190
|
111
|
130
|
81
|
20
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Nitto Denko Corporation | 7879 |
96 |
| LG Chem, Ltd. | 17205 |
92 |
| 3m Innovative Properties Company | 18406 |
83 |
| Lintec Corporation | 1915 |
57 |
| Avery Dennison Corporation | 1291 |
22 |
| Tesa SE | 1011 |
21 |
| DIC Corporation | 3597 |
18 |
| Mitsui Chemicals Tohcello, Inc. | 252 |
12 |
| Roku, Inc. | 1151 |
12 |
| Hitachi Chemical Company, Ltd. | 2455 |
10 |
| Brother Industries, Ltd. | 13000 |
10 |
| Dexerials Corporation | 1826 |
10 |
| Iconex, LLC | 179 |
10 |
| Samsung Display Co., Ltd. | 30585 |
9 |
| The Furukawa Electric Co., Ltd. | 3486 |
9 |
| Showa Denko Materials Co., Ltd. | 629 |
9 |
| Sekisui Chemical Co., Ltd. | 3159 |
8 |
| Samsung Electronics Co., Ltd. | 131630 |
7 |
| DONGWOO FINE-CHEM Co., Ltd. | 1163 |
7 |
| Samsung SDI Co., Ltd. | 6671 |
6 |
| Other owners | 500 |